JPS617697A - 多層配線基板及びその製造方法 - Google Patents

多層配線基板及びその製造方法

Info

Publication number
JPS617697A
JPS617697A JP59128604A JP12860484A JPS617697A JP S617697 A JPS617697 A JP S617697A JP 59128604 A JP59128604 A JP 59128604A JP 12860484 A JP12860484 A JP 12860484A JP S617697 A JPS617697 A JP S617697A
Authority
JP
Japan
Prior art keywords
thin film
multilayer wiring
thick
wiring board
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59128604A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363237B2 (en]
Inventor
松崎　壽夫
東夫 反町
清 佐藤
工 鈴木
岳史 椙井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59128604A priority Critical patent/JPS617697A/ja
Publication of JPS617697A publication Critical patent/JPS617697A/ja
Publication of JPH0363237B2 publication Critical patent/JPH0363237B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electronic Switches (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP59128604A 1984-06-22 1984-06-22 多層配線基板及びその製造方法 Granted JPS617697A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59128604A JPS617697A (ja) 1984-06-22 1984-06-22 多層配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59128604A JPS617697A (ja) 1984-06-22 1984-06-22 多層配線基板及びその製造方法

Publications (2)

Publication Number Publication Date
JPS617697A true JPS617697A (ja) 1986-01-14
JPH0363237B2 JPH0363237B2 (en]) 1991-09-30

Family

ID=14988879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59128604A Granted JPS617697A (ja) 1984-06-22 1984-06-22 多層配線基板及びその製造方法

Country Status (1)

Country Link
JP (1) JPS617697A (en])

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62279695A (ja) * 1986-05-29 1987-12-04 株式会社住友金属セラミックス セラミツク多層配線基板
JPH0322588A (ja) * 1989-06-20 1991-01-30 Mitsubishi Materials Corp ピンレスグリッドアレイ型多層混成集積回路
JPH0368195A (ja) * 1989-08-05 1991-03-25 Nippondenso Co Ltd セラミック積層基板およびその製造方法
JPH05206646A (ja) * 1992-01-29 1993-08-13 Nec Corp 内層低抵抗入りプリント配線板
JP2007040474A (ja) * 2005-08-04 2007-02-15 Nissan Motor Co Ltd 脈動吸収装置
JP2009067295A (ja) * 2007-09-14 2009-04-02 Toyoda Gosei Co Ltd 空調用ダクト

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4963962A (en]) * 1972-10-27 1974-06-20
JPS54135360A (en) * 1978-04-13 1979-10-20 Oki Electric Ind Co Ltd Multiilayer ceramic board
JPS5598897A (en) * 1979-01-23 1980-07-28 Nippon Electric Co Multilayer circuit board
JPS5642399A (en) * 1979-09-13 1981-04-20 Fujitsu Ltd System for producing multilayer wiring board
JPS56107598A (en) * 1980-11-25 1981-08-26 Hitachi Ltd Method of manufacturing integrated circuit board
JPS56118395A (en) * 1980-02-23 1981-09-17 Tokyo Shibaura Electric Co Method of forming multilayer wire
JPS5759472A (en) * 1980-09-25 1982-04-09 Hitachi Ltd Starting and stopping circuit for switching regulator

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4963962A (en]) * 1972-10-27 1974-06-20
JPS54135360A (en) * 1978-04-13 1979-10-20 Oki Electric Ind Co Ltd Multiilayer ceramic board
JPS5598897A (en) * 1979-01-23 1980-07-28 Nippon Electric Co Multilayer circuit board
JPS5642399A (en) * 1979-09-13 1981-04-20 Fujitsu Ltd System for producing multilayer wiring board
JPS56118395A (en) * 1980-02-23 1981-09-17 Tokyo Shibaura Electric Co Method of forming multilayer wire
JPS5759472A (en) * 1980-09-25 1982-04-09 Hitachi Ltd Starting and stopping circuit for switching regulator
JPS56107598A (en) * 1980-11-25 1981-08-26 Hitachi Ltd Method of manufacturing integrated circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62279695A (ja) * 1986-05-29 1987-12-04 株式会社住友金属セラミックス セラミツク多層配線基板
JPH0322588A (ja) * 1989-06-20 1991-01-30 Mitsubishi Materials Corp ピンレスグリッドアレイ型多層混成集積回路
JPH0368195A (ja) * 1989-08-05 1991-03-25 Nippondenso Co Ltd セラミック積層基板およびその製造方法
JPH05206646A (ja) * 1992-01-29 1993-08-13 Nec Corp 内層低抵抗入りプリント配線板
JP2007040474A (ja) * 2005-08-04 2007-02-15 Nissan Motor Co Ltd 脈動吸収装置
JP2009067295A (ja) * 2007-09-14 2009-04-02 Toyoda Gosei Co Ltd 空調用ダクト

Also Published As

Publication number Publication date
JPH0363237B2 (en]) 1991-09-30

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